In a major milestone for India’s technology ambitions, the foundation stone for the country’s first advanced 3D semiconductor packaging unit has been laid at Info Valley in Bhubaneswar, marking a big step towards building a strong domestic chip ecosystem.
The project, developed by 3D Glass Solutions, was inaugurated in the presence of Odisha Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw. It positions Odisha at the forefront of India’s push into high-end semiconductor manufacturing.
This upcoming facility will focus on advanced 3D chip packaging technology—an essential component for next-generation innovations such as artificial intelligence, 5G, high-performance computing, and defence electronics. Once operational, it is expected to significantly strengthen India’s semiconductor value chain.
Speaking at the event, Mohan Charan Majhi described the project as a historic moment for both the state and the country. He highlighted that Odisha is emerging as a key technology hub, moving beyond its traditional strengths in minerals and metals to advanced sectors like electronics and semiconductors.
The project involves an investment of nearly ₹2,000 crore and is expected to produce 70,000 glass panels annually, along with millions of advanced semiconductor units. It is also set to generate employment opportunities for engineers, diploma holders, and skilled workers, supporting the state’s transition to a technology-driven economy.
Union Minister Ashwini Vaishnaw noted that India’s electronics manufacturing sector has seen rapid growth in recent years, with the country now emerging as one of the largest mobile phone manufacturers globally. He added that Odisha is playing an increasingly important role in this transformation.
The facility will cater to a wide range of high-growth sectors, including data centres, AI, machine learning, telecommunications, automotive technologies, aerospace, and defence systems. Commercial production is expected to begin by 2028, with full-scale operations targeted by 2030.
The initiative is part of the broader India Semiconductor Mission and aligns with the vision of Narendra Modi to make India self-reliant in electronics and semiconductor manufacturing.
With this project, Odisha is positioning itself as a major destination for semiconductor investments, signalling a shift towards future technologies and reinforcing India’s ambitions to become a global leader in electronics manufacturing.
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